目 录

第1章 引子：从中国到美国 ·······················································1

1.1 在上海—未识芯片 ······························································1

1.2 渡洋求学—从机械到电子 ·····················································3

1.3 在芝加哥—学做工程师 ························································4

1.4 在洛杉矶—结缘电动汽车 ·····················································5

1.5 从洛杉矶到硅谷—结缘芯片 ··················································7

第2章 芯片产业的产品线经理是怎么回事 ··································9

2.1 芯片产品线经理的职责解析 ·····················································9

2.2 芯片的市场战略初探 ·····························································17

2.2.1 芯片产品线核心战略观 ································································18

2.2.2 目标市场的划分 ·········································································21

2.2.3 目标市场的分析 ·········································································24

2.2.4 针对细分市场而有所为 ································································29

2.2.5 研发合适的芯片来销售到该细分市场 ··············································35

2.3 芯片产品路线的规划和平台设计 ··············································38

2.3.1 为何需要芯片产品路线 ································································38



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2.3.2 芯片产品路线需要沟通和支持 ·······················································41

2.3.3 芯片产品的平台战略 ···································································43

2.3.4 芯片平台战略中对芯片工艺的选择判断 ···········································45

2.3.5 做芯片产品路线图的准备工作 ·······················································47

2.3.6 做芯片产品路线图中需要考虑的问题 ··············································48

2.3.7 芯片产品路线图举例：无锡芯朋微 ·················································51

2.3.8 芯片产品路线图的后期修改 ··························································54

2.4 如何做一份无懈可击的商业计划书 ················································55

2.4.1 何谓商业计划书 ·········································································55

2.4.2 商业计划书全解析 ······································································59

2.5 项目管理 ············································································71

2.5.1 芯片项目从计划到量产的整体开发流程 ···········································73

2.5.2 项目周会 ··················································································74

2.5.3 不断降低成本 ············································································77

2.5.4 高风险项目管理 ·········································································78

2.5.5 项目的暂停和终止 ······································································79

2.6 产品市场部门的构成 ·····························································80

2.6.1 纵向和横向的市场组织 ································································81

2.6.2 寻找最合适的产品/市场人才 ·························································84

2.6.3 试论商务拓展经理 ······································································85

2.6.4 试论战略市场经理 ······································································86

2.6.5 试论技术市场经理 ······································································87

2.6.6 试论内部产品应用团队 ································································87

2.6.7 试论战术市场经理 ·············································································89

2.7 产品推广的全方位战术 ··························································90

2.7.1 客户支持需要 ············································································92

2.7.2 市场宣传的需要 ·········································································94

2.7.3 按重要性区分的推广方式 ·····························································98

2.8 销售和产品线的季度业务审查 ···················································99

2.8.1 成长良好的产品线QBR重点 ·························································101

2.8.2 需要扭转势头的产品线QBR重点 ···················································104



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目 录

第3章 芯片产品线经理的人事管理 ··········································106

3.1 如何向上管理领导 ······························································107

3.2 如何向下管理芯片产品和市场团队 ··········································112

3.3 如何平行管理芯片工程师团队 ···············································120

3.4 产品线经理与芯片销售 ························································125

3.4.1 销售团队的兴趣 ········································································125

3.4.2 如何支持销售 ···········································································129

3.4.3 客户谈判 ·················································································131

3.4.4 基于采购量的价格 ·····································································133

3.4.5 面向销售的培训 ········································································134

3.4.6 销售季度业务审查 ·····································································135

3.5 产品线经理与现场工程师 ·····················································139

3.5.1 FAE的5种分类 ··········································································141

3.5.2 FAE的9种责任 ··········································································144

3.5.3 与FAE的产品培训 ·····································································149

3.6 产品线经理与芯片代理商 ·····················································149

3.6.1 芯片代理商的分类 ·····································································150

3.6.2 原厂如何配合好代理商 ·······························································151

3.6.3 代理商如何更好地配合原厂和彰显自己的价值 ·································158

3.7 产品线经理如何寻求资源和请求帮助 ······································161

3.7.1 寻求公司内部的帮助 ··································································162

3.7.2 寻求公司外部的帮助 ··································································163

3.7.3 市场营销的训练项目 ··································································164

第4章 赢得芯片客户的艺术 ····················································166

4.1 我们为什么要见客户 ···························································166

4.2 客户为什么要见我们 ···························································170

4.3 芯片销售的原理和赢得生意的6个阶段 ·····································173

4.3.1 发掘客户 ·················································································173

4.3.2 验证机会 ·················································································175



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4.3.3 回到产品线 ··············································································176

4.3.4 赢得设计 ·················································································177

4.3.5 保持客户 ·················································································182

4.3.6 失败以后 ·················································································184

4.4 芯片公司如何选择目标客户 ··················································185

4.4.1 选择最佳的目标客户 ··································································186

4.4.2 发掘目标客户所重视的价值 ·························································187

4.4.3 分配资源来实现这些价值 ····························································188

4.4.4 与客户的互动过程 ·····································································188

4.4.5 什么样的客户可以算是好客户 ······················································189

4.5 打造高效客户访问 ······························································191

4.6 乔布斯演讲的艺术如何用于介绍芯片 ······································196

4.6.1 回答那个最关键的问题 ·······························································197

4.6.2 演讲标题 ·················································································198

4.6.3 对产品的热情 ···········································································199

4.6.4 三条核心信息 ···········································································199

4.6.5 寻找需要解决的问题 ··································································200

4.6.6 让观众能够关注 ········································································200

4.6.7 少用纯文字，使用其他媒体 ·························································201

4.6.8 让数字变得更有趣 ·····································································203

4.6.9 分享舞台 ·················································································203

4.7 芯片定价的艺术 ·································································204

4.7.1 因客户而异的定价 ·····································································205

4.7.2 捆绑式定价 ··············································································206

4.7.3 动态定价 ·················································································206

4.7.4 竞争定价 ·················································································208

4.7.5 在缺货时的定价 ········································································210

4.8 客户谈判的艺术 ··································································211

4.8.1 价格谈判的一些常见误区 ····························································213

4.8.2 销售如何说服产品线提供较低的报价 ·············································214



目 录

4.8.3 销售和FAE如何说服客户接受较高的价格 ·······································215

4.8.4 附属话题：TQRDC的供应商选择体系 ············································217

4.9 客户支持的迷思 ·································································218

第5章 放眼看世界 ···································································221

5.1 海外的芯片地域市场概览 ·····················································222

5.1.1 美洲市场 ·················································································222

5.1.2 欧洲市场 ·················································································225

5.1.3 日本市场 ·················································································226

5.1.4 韩国市场 ·················································································227

5.1.5 新加坡和印度市场 ·····································································228

5.2 访问中国芯片客户的故事 ·····················································229

5.3 国产芯片突围的一些想法 ·····················································234

5.4 国产芯片公司的出海之思考 ··················································243

5.4.1 为何需要出海 ···········································································243

5.4.2 出海销售之思考 ········································································246

第6章 如何在芯片行业成为合格的产品和市场人员 ·················249

6.1 给有兴趣在芯片行业做产品管理的朋友们一些建议 ····················249

6.2 从其他背景转行到芯片产业 ··················································252

6.2.1 从工程师到产品市场经理 ····························································252

6.2.2 从销售到产品/市场 ····································································253

6.2.3 转到产品市场方向是一条不归路 ···················································253

6.2.4 做产品/市场经理的条件 ······························································254

6.3 产品线经理的自身修行 ························································256

6.3.1 培养良好的营销习惯 ··································································257

6.3.2 建立营销的思维 ········································································260

6.3.3 理解产品线经理个人成功的因素 ···················································262

6.3.4 在路上 ····················································································263



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6.3.5 产品线经理的16条自问 ·······························································264

6.4 推荐一些有价值的书和网站 ··················································268

全书总结 ····················································································271

附录A 书中部分英文缩写关键词索引 ······································273

附录B 书中部分英文芯片公司名索引 ······································275